Download PDF by John G. Webster (Editor) : 21.Electronic Materials

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Zone IV: Low Precipitation Region. In this region which corresponds to larger distances from the interface, precipitates are found only at the grain boundaries, denoting that carbon also diffuses for longer distances along grain boundaries than in the bulk. Zone V: Base Nickel Alloy. This region corresponds to the base microstructure of the nickel alloy. Formation of Intermetallics. A Ti alloy/stainless steel couple is considered here. This combination is a good example of intermetallic forming systems because it is well known that Ti forms a large set of intermetallics with iron, Ni, and Cr (63,64) which are the base of the present steel to be bonded to the titanium alloy.

Sci. , 9: 441–444, 1993. 337 52. T. S. Baker and P. G. Partridge, in R. ), Diffusion Bonding, Cranfield, England: SIS, 1987, pp. 73–89. 53. J. L. Alcaraz, J. M. Martı´nez-Esnaola, and J. Gil-Sevillano, Int. J. Solid Structures, 33: 2075–2093, 1996. 54. J. L. Alcaraz, J. M. Martı´nez-Esnaola, and J. Gil-Sevillano, Int. Solids Structures, 34, 603–623 and 625–638 (Part II), 1997. 55. J. L. Alcaraz, J. Gil-Sevillano, and J. M. Martı´nez-Esnaola, J. Mater. Proc. , 61: 265–274, 1996. 56. B. D. Thesis, Facultad de Ciencias, University de Navarra, San Sebastia´n, Spain, 1993.

Its advantages are high thermal and electrical conductivity (surpassed only by pure silver) and relatively low cost. Copper is easily soldered to and has good mechanical characteristics, including tensile strength, toughness, and ductility. Due to its low coefficient of thermal expansion and high ten- 82 CONDUCTING MATERIALS Table 1. 1 TCR (⍀/⍀ · ЊC in ppm) 4500 5100 — 6100 9000 4600 4300 4800 4600 — — 8700 2400 6600 4300 3500 4400 5200 3930 6510 3680 5000 3700 3700 9700 5300 6920 4200 3770 3927 Ϫ2080 (107ЊC) 4600 4300 5300 4100 5500 5000 3830 5200 3800 3640 3500 4500 2100 (27ЊC) 3900 4190 4000 sile strength, copper finds widespread use in overhead transmission lines.

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21.Electronic Materials by John G. Webster (Editor)


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